TSM Oven and Soldering Machines TSM offer the best solutions for reflow and wave soldering equipped with most advanced technology along with its hope of contribution to environment.
Heating and cooling function applicable for the lead-free soldering of various boards.
Energy saving design considering the global warming.
Compact design emphasizing the productivity and floor environment.
Flux recovery function that increased the degree of cleanliness of oven exhausted air.
Added rich productivity management information for operation status, history and output management.
Electrical wiring and structure frame design that improve the maintenance-ability.
Semi compact size solder wave. Applicable to lead free operations. 2 zones forced air preheating, finger conveyor type, special SMD and standard nozzle. Thanks to this specifications HS03-2000 ensure high soldering quality.
Fully automated, the HS04-3000C has implemented lead free soldering that realizes human oriented environmentally friendly soldering technology.
The HS04-3000C model pursues convenience in operation and maintenance, guarantees the highest soldering quality for all types of PCBs by adopting a highly unique solder nozzle type.
Features Designed for the production of various products in small quantity Easy to install due to compact structure Low power consumption
Step by Step Conveyor System Optimized soldering reliability through application of 3P system PCB pre-heating time control→Efficient pre-heating Dip time control (3~4 seconds): controlled by the conveyor speed (0.3~0.4 m/min) PCB cooling: forced PCB cooling during pre-heating
Designed for the production of various products in small quantity
