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PICK AND PLACE

SCREEN PRINTER

HANDLING SYSTEMS

OVEN
SOLDER WAVE


AUTOMATICAL OPTICAL INSPECTION

X-RAY



Pick and Place

SM400 SERIES

SM421 Flexible Mounter




Placement Speed:
  - Chip 21K CPH (IPC9850)
  - QFP 6K CPH (IPC9850)
Applicable parts:
  Max. 0402 ~ 55mm (Part height H=15mm)
Placement Accuracy:
  - Chip 50µm@3σ (Cpk 1.0)
  - QFP 30µm@3σ (Cpk 1.0)
Applicable PCBs:
  - L460 x W400 x 1Lane (Standard)
  - Max. L610 x W510 x 1Lane (Option)
SPECIFICATION FEATURES


SPECIFICATION Top
Alignment Flying Vision + Stage Vision
Number of Spindles
6 Spindles x 1 Gantry
Placement Rate
Flying Vision
Chip 1608 21,000 CPH (IPC9850)
SOP 15,000 CPH (IPC9850)
QFP 5,500 CPH (IPC9850)
Stage Vision
1.4sec / QFP 208 (Tray Supply Standard)
Placement Accuracy
Chip / QFP
±50µm@µ + 3σ / Chip, ±30µm@µ + 3σ / QFP
(Based on the standard chips)
Component Range Flying Vision 0603 ~ 22mm IC
(Option : 0402 Please contact us. The more information will be available upon your request.)
Standard Stage Vision (FOV45)
~ 42mm IC (Lead Pitch 0.4mm) / ~ 55mm (MFOV)
Optional Stage Vision (FOV35)
~ 32mm IC (Lead Pitch 0.3mm) / ~ 55mm (MFOV)
Max. Height
H = 12mm (Flying Camera Standard)
H = 15mm (Stage Camera Standard)
Board Dimension (mm)
Minimum
50(L) x 40(W)
Maximum
460(L) x 400(W)
Option : 510(L) x 460(W), 610(L) x 510(W)
PCB Thickness
0.38mm ~ 4.2mm
Feeder Capacity
120ea / 112ea (Docking Cart)
Utility
Power
AC200 / 208 / 220 / 240 / 380 / 415 V (50/60Hz, 3Phase)
RMS 3kVA (Max. 4.7kVA)
Air Consumption
0.5 ~ 0.7MPa (5.1 ~ 7.1kgf/cm²), 260N l/min
Weight 1,800kg
External Dimension (mm) 1,650(L) x 1,690(D) x 1,535(H)


FEATURES Top

Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603 microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with fine pitch such as 55mm with 0.4mm pitch by adopting a mega pixel vision system for the Stage camera. It allows IC parts to be placed with high accuracy of 30 microns. It also easily registers parts of complicated shape by supporting the polygon recognition algorithm.

Powerful Vision Algorithm

The SM Series increases recognition accuracy by removing component image noise function and implementing an automatic teaching function. The flying camera helps recognize and compensate for components such as chip, TR, BGA and QFP as they are picked up and transferred to the
placement point. Productivity and economic efficiency are improved with a new function that recognizes the position of the tape pocket from which the component is picked up.

Split Recognition for Large Component: ~ 55mm BGA (1.0mm Ball Pitch) / Connector, 72mm long in the diagonal direction / Using 45mm FOV stage camera

Real-Time Automatic Pickup Position Compensation

Polygon Function

The polygon recognition function was added to reinforce the applicability to odd shaped parts.
The polygon recognition function, which extracts the part shape and recognizes the shape of the part entirely, provides optimal solution to the placement of irregular shaped SMD parts.





ACCESSORY Top
New Concept Non-stop Tape Feeder - SM Tape Feeder

The newly developed SM tape feeder utilizes nozzles specifically designed for fine pitch combined with an improved vision algorithm makes placement of 0402 (01005), 0603 (0201) and 1005 (0402) easy, even on a tight grid.
New Non Stop Tray Feeder






The tray feeder can replenish parts during placement without stopping the machine. It uses one upper buffer and can hold up to 2 trays per pallet.
Placement Accuracy Measuring Jig


This tool can measure the Cpk of the machine on-site. It can check the Cp and Cpk for each head and total Cp and Cpk. Using the Cpk calculating program and verifying the placement position with the fiducial camera after placing the part using the provided PCB file.


New Series SM400
Modularity, Throughput, Reliability




Daewon Europa (Italy)


Demco (Korea)


DAEWON-SMT S.p.A.
Viale dell'industria, 3
27020 Trivolzio (PV) Italy
P.IVA 03727500963
©2005 All Rights Reserved


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