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TSM Oven and Soldering Machines
Daewon-smt propone forni a saldatrici TSM. La migliore soluzione per sistemi di saldatura e rifusione in tecnologia Lead Free.
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| REFLOW OVEN |
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N30 e A30 |
Heating and cooling function applicable for the lead-free soldering of various boards.
Energy saving design considering the global warming.
Compact design emphasizing the productivity and floor environment.
Flux recovery function that increased the degree of cleanliness of oven exhausted air.
Added rich productivity management information for operation status, history and output management.
Electrical wiring and structure frame design that improve the maintenance-ability. |
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WAVE SOLDERING
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more info |
HS03-2000 |
| Saldatrice a onda semi-compatta. Adatta alla saldatura Lead Free. 2 zone di preriscaldo ad aria forzata, covogliatore a finger, speciali nozzle per onda SMD e onda principale. Grazie a queste caratteristiche la HS03-2000 garantisce un’elevata qualità di saldatura. |
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HS04-3000C |
Fully automated, the HS04-3000C has implemented lead free soldering that realizes human oriented environmentally friendly soldering technology.
The HS04-3000C model pursues convenience in operation and maintenance, guarantees the highest soldering quality for all types of PCBs by adopting a highly unique solder nozzle type. |
more info |
MS07-1500 |
Features
 Designed for the production of various products in small quantity
Easy to install due to compact structure
Low power consumption
Step by Step Conveyor System
Optimized soldering reliability through application of 3P system
PCB pre-heating time control→Efficient pre-heating
Dip time control (3~4 seconds): controlled by the conveyor speed (0.3~0.4 m/min)
PCB cooling: forced PCB cooling during pre-heating
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