|
 |
Pick and Place
SM400 SERIES
|
| SM421 Flexible Mounter |
|
 |
 Placement Speed:
- Chip 21K CPH (IPC9850)
- QFP 6K CPH (IPC9850)
Applicable parts:
Max. 0402 ~  55mm (Part height H=15mm)
Placement Accuracy:
- Chip 50µm@3σ (Cpk 1.0)
- QFP 30µm@3σ (Cpk 1.0)
Applicable PCBs:
- L460 x W400 x 1Lane (Standard)
- Max. L610 x W510 x 1Lane (Option) |
|
| SPECIFICATION |
 Top |
| Alignment |
Flying Vision + Stage Vision |
Number of Spindles |
6 Spindles x 1 Gantry |
|
Placement Rate
|
Flying Vision |
Chip 1608 21,000 CPH (IPC9850)
SOP 15,000 CPH (IPC9850)
QFP 5,500 CPH (IPC9850) |
Stage Vision |
1.4sec / QFP 208 (Tray Supply Standard) |
|
Placement Accuracy |
Chip / QFP |
±50µm@µ + 3σ / Chip, ±30µm@µ + 3σ / QFP
(Based on the standard chips) |
| Component Range |
Flying Vision |
0603 ~ 22mm IC
(Option : 0402 Please contact us. The more information will be available upon your request.) |
Standard Stage Vision (FOV45) |
~ 42mm IC (Lead Pitch 0.4mm) / ~ 55mm (MFOV) |
Optional Stage Vision (FOV35) |
~ 32mm IC (Lead Pitch 0.3mm) / ~ 55mm (MFOV) |
Max. Height |
H = 12mm (Flying Camera Standard)
H = 15mm (Stage Camera Standard) |
|
Board Dimension (mm) |
Minimum |
50(L) x 40(W) |
|
Maximum |
460(L) x 400(W)
Option : 510(L) x 460(W), 610(L) x 510(W) |
|
PCB Thickness |
0.38mm ~ 4.2mm |
|
Feeder Capacity |
120ea / 112ea (Docking Cart) |
| Utility |
Power |
AC200 / 208 / 220 / 240 / 380 / 415 V (50/60Hz, 3Phase)
RMS 3kVA (Max. 4.7kVA) |
|
Air Consumption |
0.5 ~ 0.7MPa (5.1 ~ 7.1kgf/cm²), 260N l/min |
| Weight |
1,800kg |
| External Dimension (mm) |
1,650(L) x 1,690(D) x 1,535(H) |
|
| FEATURES |
Top |
Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts
from 0603 microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts
with fine pitch such as 55mm with 0.4mm pitch by adopting a mega pixel vision system for the Stage camera.
It allows IC parts to be placed with high accuracy of 30 microns. It also easily registers parts of complicated
shape by supporting the polygon recognition algorithm.
|
| Powerful Vision Algorithm |
The SM Series increases recognition accuracy by removing component image noise function and implementing an automatic teaching function.
The flying camera helps recognize and compensate for components such as chip, TR, BGA and QFP as they are picked up and transferred to the
placement point. Productivity and economic efficiency are improved with a new function that recognizes the position of the tape pocket
from which the component is picked up.
Split Recognition for Large Component:
~ 55mm BGA (1.0mm Ball Pitch) / Connector, 72mm long in the diagonal direction / Using 45mm FOV stage camera
Real-Time Automatic Pickup Position Compensation
|
| Polygon Function |
 |
The polygon recognition function
was added to reinforce the
applicability to odd shaped parts.
The polygon recognition function,
which extracts the part
shape and recognizes the shape
of the part entirely, provides optimal
solution to the placement of
irregular shaped SMD parts.
|
|
|
|
|
|
